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1 of 21 rev: 040203 note: some revisions of this device may incorporate deviations from published specifications known as errata. multiple revisions of any device may be simultaneously available through various sales channels. for information about device errata, click here: www.maxim-ic.com/errata . description the DS1315 phantom time chip is a combination of a cmos timekeeper and a nonvolatile memory controller. in the absence of power, an external battery maintains the timekeeping operation and provides power for a cmos static ram. the watch keeps track of hundredths of seconds, seconds, minutes, hours, day, date, month, and year information. the last day of the month is automatically adjusted for months with less than 31 days, including leap year correction. the watch operates in one of two formats: a 12-hour mode with an am/pm indicator or a 24-hour mode. the nonvolatile controller supplies all the necessary support circuitry to convert a cmos ram to a nonvolatile memory. the DS1315 can be interfaced with either ram or rom without leaving gaps in memory. pin configurations pin configurations continued at end of data sheet. features real time clock keeps track of hundredths of seconds, seconds, minutes, hours, days, date of the month, months, and years adjusts for months with fewer than 31 days automatic leap year correction valid up to 2100 no address space required to communicate with rtc provides nonvolatile cont roller functions for battery backup of sram supports redundant battery attachment for high?reliability applications full 10% v cc operating range +3.3 volt or +5 volt operation industrial (?45c to +85c) operating temperature ranges available drop in replacement for ds1215 pin description x1, x2 - 32.768 khz crystal connection we - write enable bat1 - battery 1 input gnd - ground d - data input q - data output rom/ ram - rom/ram mode select ceo - chip enable output cei - chip enable input oe - output enable rst - reset bat2 - battery 2 input v cc0 - switched supply output v cc1 - power supply input www.dalsemi.com DS1315 phantom time chip www.maxim-ic.com 16-pin dip ( 300-mil ) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 v cc1 v cc0 bat2 rst oe cei ceo rom/ram x1 x2 we bat1 gnd d q gnd
DS1315 phantom time chip 2 of 21 ordering information part temp range pin-package top mark DS1315-5 0c to +70c 16 dip DS1315 56 DS1315-33 0c to +70c 16 dip DS1315 336 DS1315n-5 -40c to +85c 16 dip DS1315 56 DS1315n-33 -40c to +85c 16 dip DS1315 336 DS1315e-5 0c to +70c 20 tssop DS1315e 56 DS1315e-33 0c to +70c 20 tssop DS1315e 336 DS1315en-5 -40c to +85c 20 tssop DS1315e xxxxx-56 DS1315en-33 -40c to +85c 20 tssop DS1315e xxxx-336 DS1315en-33/t&r -40c to +85c 20 tssop DS1315e xxxx-336 DS1315en-5/t&r -40c to +85c 20 tssop DS1315e xxxxx-56 DS1315s-5 0c to +70c 16 so DS1315s 56 DS1315s-33 0c to +70c 16 so DS1315s 336 DS1315s-5/t&r 0c to +70c 16 so DS1315s 56 DS1315sn-5 -40c to +85c 16 so DS1315s 56 DS1315sn-33 -40c to +85c 16 so DS1315s 336 note: an ?n? located in the bottom right-hand corner of the top of the package denotes an industrial device. ?xxxx? can be any combi nation of characters. figure 1. block diagram
DS1315 phantom time chip 3 of 21 operation communication with the time chip is established by pattern recognition of a serial bit stream of 64 bits which must be matched by executing 64 consecutive write cycles containing the proper data on data in (d). all accesses which occur prior to recognition of the 64-bit pattern are directed to memory via the chip enable output pin ( ceo ). after recognition is established, the next 64 read or write cycles either extract or update data in the time chip and ceo remains high during this time, disabling the connected memory. data transfer to and from the timekeeping function is accomplished with a serial bit stream under control of chip enable input ( cei ), output enable ( oe ), and write enable ( we ). initially, a read cycle using the cei and oe control of the time chip starts the pattern recognition sequence by moving pointer to the first bit of the 64-bit comparison register. next, 64 consecutive write cycles are executed using the cei and we control of the time chip. these 64 write cycles are used only to gain access to the time chip. when the first write cycle is executed, it is compared to bit 1 of the 64-bit comparison register. if a match is found, the pointer increments to the next location of the comparison register and awaits the next write cycle. if a match is not found, the pointer does not adva nce and all subsequent write cycles are ignored. if a read cycle occurs at any time during pattern recognition, the present sequence is aborted and the comparison register pointer is reset. pattern recognition continues for a total of 64 write cycles as described above until all the bits in the comparison register have been matched. (this bit pattern is shown in figure 2). with a correct match for 64 bits, the time chip is enabled and data transfer to or from the timekeeping registers may proceed. the next 64 cycles w ill cause the time chip to either receive data on d, or transmit data on q, depending on the level of oe pin or the we pin. cycles to other locations outside the memory block can be interleaved with cei cycles without interrupting the pattern recognition sequence or data transfer sequence to the time chip. a standard 32.768 khz quartz crystal can be directly c onnected to the DS1315 via pins 1 and 2 (x1, x2). the crystal selected for use should have a specified load capacitance (c l ) of 6 pf. for more information on crystal selection and crystal layout considera tions, please consult application note 58, ?crystal considerations with dalla s real time clocks.?
DS1315 phantom time chip 4 of 21 figure 2. time chip comparison register definition note: the pattern recognition in hex is c5, 3a, a3, 5c, c5, 3a, a3, 5c. the odds of this pattern being accidentally duplicated and causing inadvertent entry to the phantom time chip are less than 1 in 10 19 .
DS1315 phantom time chip 5 of 21 nonvolatile controller operation the operation of the nonvolatile controller circuits within the time chip is determined by the level of the rom/ ram select pin. when rom/ ram is connected to ground, the controller is set in the ram mode and performs the circuit functions required to make cmos ram and the timekeeping function nonvolatile. a switch is provide d to direct power from the battery inputs or v cci to v cco with a maximum voltage drop of 0.3 volts. the v cco output pin is used to supply uninterrupted power to cmos sram. the DS1315 also performs redundant battery c ontrol for high reliability. on power-fail, the battery with the highest voltage is automatically switched to v cco . if only one battery is used in the system, the unused battery input should be connected to ground. the DS1315 safeguards the time chip and ram data by power-fail detecti on and write protection. power-fail detection occurs when v cci falls below v pf which is set by an internal bandgap reference. the DS1315 constantly monitors the v cci supply pin. when v cci is less than v pf , power-fail circuitry forces the chip enable output ( ceo ) to v cci or v bat -0.2 volts for external ram write protection. during nominal supply conditions, ceo will track cei with a propagation delay. internally, the DS1315 aborts any data transfer in progress without changing any of the time chip registers and prevents future access until v cci exceeds v pf . a typical ram/time chip interface is illustrated in figure 3. when the rom/ ram pin is connected to v cco , the controller is set in the rom mode. since rom is a read-only device that retains data in the absence of power, battery backup a nd write protection is not required. as a result, the chip enable logic will force ceo low when power fails. however, the time chip does retain the same intern al nonvolatility and write protection as described in the ram mode. a typical rom/time chip interface is illustrated in figure 4. figure 3. DS1315-to-ram/time chip interface
DS1315 phantom time chip 6 of 21 figure 4. rom/time chip interface time chip register information time chip information is contained in eight register s of 8 bits, each of which is sequentially accessed 1 bit at a time after the 64-bit pattern recognition se quence has been completed. when updating the time chip registers, each must be handled in groups of 8 bits. writing and reading individual bits within a register could produce erroneous results. these re ad/write registers are defined in figure 5. data contained in the time chip registers is in binary coded decimal format (bcd). reading and writing the registers is always accomplished by stepping though all eight registers, starting with bit 0 of register 0 and ending with bit 7 of register 7. am?pm/12/24 mode bit 7 of the hours register is defined as the 12- or 24-hour mode select bit. when high, the 12-hour mode is selected. in the 12-hour mode, bit 5 is the am/pm bit with logic high being pm. in the 24-hour mode, bit 5 is the second 10-hour bit (20-23 hours). oscillator and reset bits bits 4 and 5 of the day register are used to control the reset and oscillator functions. bit 4 controls the reset pin input. when the reset bit is set to logic 1, th e reset input pin is ignored. when the reset bit is set to logic 0, a low input on the reset pin will cause the time chip to abort data transfer without changing data in the timekeeping registers. reset operates independently of all other in-puts. bit 5 controls the oscillator. when set to logic 0, the oscillator turns on and the real time clock/calendar begins to increment.
DS1315 phantom time chip 7 of 21 zero bits registers 1, 2, 3, 4, 5, and 6 contain 1 or more bits that will always read logic 0. when writing these locations, either a logic 1 or 0 is acceptable. figure 5. time chip register definition
DS1315 phantom time chip 8 of 21 absolute maximum ratings voltage range on any pin relative to ground -0.3v to +7.0v operating temperature range, commercial 0c to +70c operating temperature range, industrial -45c to +85c storage temperature range -55c to +125c soldering temperature see ipc/jedec j-std-020a this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in t he operation sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods of time may affect reliability. recommended dc operating conditions (0c to 70c) parameter symbol min typ max units notes power supply voltage 5 volt operation v cc 4.5 5.0 5.5 v 1 power supply voltage 3.3 volt operation v cc 3.0 3.3 3.6 v 1 input logic 1 v ih 2.2 v cc +0.3 v 1 input logic 0 v il -0.3 +0.6 v 1 battery voltage v bat1 or v bat2 v bat1, v bat2 2.5 3.7 v dc operating electrical characteristics (0c to 70c; v cc = 5.0 10%) parameter symbol min typ max units notes average v cc power supply current i cc1 5 ma 6 v cc power supply current, (v cc0 = v cci -0.3) i cc01 150 ma 7 ttl standby current ( cei = v ih ) i cc2 3 ma 6 cmos standby current ( cei = v cci -0.2) i cc3 1 ma 6 input leakage current (any input) i il -1 +1 a 10 output leakage current (any input) i ol -1 +1 a output logic 1 voltage (i out = -1.0 ma) v oh 2.4 v 2 output logic 0 voltage (i out = 4.0 ma) v ol 0.4 v 2 power-fail trip point v pf 4.25 4.5 v battery switch voltage v sw v bat1 , v bat2 13
DS1315 phantom time chip 9 of 21 dc power down electrical characteristics (0c to 70c; v cc < 4.5v) parameter symbol min typ max units notes ceo output voltage v ceo v cci -0.2 or v bat1,2 -0.2 v 8 v bat1 or v bat2 battery current i bat 0.5 a 6 battery backup current @ v cco = v bat -0.2v i cco2 10 a 9 ac electrical operat ing characteristics rom/ ram = gnd (0c to 70c; v cc = 5.0 10%) parameter symbol min typ max units notes read cycle time t rc 65 ns cei access time t co 55 ns oe access time t oe 55 ns cei to output low z t coe 5 ns oe to output low z t oee 5 ns cei to output high z t od 25 ns oe to output high z t odo 25 ns read recovery t rr 10 ns write cycle t wc 65 ns write pulse width t wp 55 ns write recovery t wr 10 ns 4 data setup t ds 30 ns 5 data hold time t dh 0 ns 5 cei pulse width t cw 55 ns oe pulse width t ow 55 ns rst pulse width t rst 65 ns
DS1315 phantom time chip 10 of 21 ac electrical operat ing characteristics rom/ ram = v cco (0c to 70c; v cc = 5.0 10%) parameter symbol min typ max units notes read cycle time t rc 65 ns cei access time t co 55 ns oe access time t oe 55 ns cei to output low z t coe 5 ns oe to output low z t oee 5 ns cei to output high z t od 25 ns oe to output high z t odo 25 ns address setup time t as 5 ns address hold time t ah 5 ns read recovery t rr 10 ns write cycle t wc 65 ns cei pulse width t cw 55 ns oe pulse width t ow 55 ns write recovery t wr 10 ns 4 data setup t ds 30 ns 5 data hold time t dh 0 ns 5 rst pulse width t rst 65 ns dc operating electrical characteristics (0c to 70c; v cc = 3.3 10%) parameter symbol min typ max units notes average v cc power supply current i cc1 3 ma 6 average v cc power supply current, (v cco = v cci -0.3) i cc01 100 ma 7 ttl standby current ( cei = v ih ) i cc2 2 ma 6 cmos standby current ( cei = v cci -0.2) i cc3 1 ma 6 input leakage current (any input) i il -1 +1 a output leakage current (any input) i lo -1 +1 a output logic 1 voltage (i out = 0.4 ma) v oh 2.4 v 2 output logic 0 voltage (i out = 1.6 ma) v ol 0.4 v 2 power-fail trip point v pf 2.8 2.97 v battery switch voltage v sw v bat1 , v bat2 , or v pf 14
DS1315 phantom time chip 11 of 21 dc power down electrical characteristics (0c to 70c; v cc < 2.97v) parameter symbol min typ max units notes ceo output voltage v ceo v cci or v bat1,2 -0.2 v 8 v bat1 or v bat2 battery current i bat 0.3 a 6 battery backup current @ v cco = v bat -0.2 i cco2 10 a 9 ac electrical operat ing characteristics rom/ ram = gnd (0c to 70c; v cc = 3.3 10%) parameter symbol min typ max units notes read cycle time t rc 120 ns cei access time t co 100 ns oe access time t oe 100 ns cei to output low z t coe 5 ns oe to output low z t oee 5 ns cei to output high z t od 40 ns oe to output high z t odo 40 ns read recovery t rr 20 ns write cycle t wc 120 ns write pulse width t wp 100 ns write recovery t wr 20 ns 4 data setup t ds 45 ns 5 data hold time t dh 0 ns 5 cei pulse width t cw 100 ns oe pulse width t ow 100 ns rst pulse width t rst 120 ns
DS1315 phantom time chip 12 of 21 ac electrical operat ing characteristics rom/ ram = v cco (0c to 70c; v cc = 3.3 10%) parameter symbol min typ max units notes read cycle time t rc 120 ns cei access time t co 100 ns oe access time t oe 100 ns cei to output low z t coe 5 ns oe to output low z t oee 5 ns cei to output high z t od 40 ns oe to output high z t odo 40 ns address setup time t as 10 ns address hold time t ah 10 ns read recovery t rr 20 ns write cycle t wc 120 ns cei pulse width t cw 100 ns oe pulse width t ow 100 ns write recovery t wr 20 ns 4 data setup t ds 45 ns 5 data hold time t dh 0 ns 5 rst pulse width t rst 120 ns capacitance (t a = 25c) parameter symbol min typ max units notes input capacitance c in 10 pf output capacitance c out 10 pf
DS1315 phantom time chip 13 of 21 figure 6. timing diagram: read cycle to time chip rom/ ram = gnd figure 7. timing diagram: write cycle to time chip rom/ ram = gnd
DS1315 phantom time chip 14 of 21 figure 8. timing diagram: read cycle to time chip rom/ ram = v cco figure 9. timing diagram: write cycle to time chip rom/ ram = v cco
DS1315 phantom time chip 15 of 21 figure 10. timing diagram: reset pulse 5v device power-up powe r-down characteristics, rom/ ram = v cco or gnd (0c to 70c) parameter symbol min typ max units notes recovery time at power-up t rec 1.5 2.5 ms 11 v cc slew rate power-down v pf (max) to v pf (min) t f 300 s 11 v cc slew rate power-down v pf (min) to v sw t fb 10 s 11 v cc slew rate power-up v pf (min) to v pf (max) t r 0 s 11 cei high to power-fail t pf 0 s 11 cei propagation delay t pd 5 ns 2, 3, 11 figure 11. 5v power-up condition rst t rst
DS1315 phantom time chip 16 of 21 figure 12. 5v power-down condition 3.3v device power-up power-down characteristics, rom/ ram = v cco or gnd (0c to 70c) parameter symbol min typ max units notes recovery time at power-up t rec 1.5 2.5 ms 12 v cc slew rate power-down v pf (max) to v pf (min) t f 300 s 12 v cc slew rate power-up v pf (min) to v pf (max) t r 0 s 12 cei high to power-fail t pf 0 s 12 cei propagation delay t pd 10 ns 2, 3, 11
DS1315 phantom time chip 17 of 21 notes: 1) all voltages are referenced to ground. 2) measured with load shown in figure 15. 3) input pulse rise a nd fall times equal 10 ns. 4) t wr is a function of the latter occurring edge of we or ce in ram mode, or oe or ce in rom mode. 5) t dh and t ds are functions of the first occurring edge of we or ce in ram mode, or oe or ce in rom mode. 6) measured without ram connected. 7) i cco1 is the maximum average load current the DS1315 can supply to external memory. 8) applies to ceo with the rom/ ram pin grounded. when the rom/ ram pin is connected to v cco , ceo will go to a low level as v cci falls below v bat . 9) i cco2 is the maximum average load current that the DS1315 can supply to memory in the battery backup mode. 10) applies to all input pins except rst . rst is pulled internally to v cci . 11) see figures 11 and 12. 12) see figures 13 and 14. 13) v sw is determined by the larger of v bat1 and v bat2 . 14) v sw is determined by the smaller of v bat1 , v bat2 , and v pf . figure 13. 3.3v power-up condition
DS1315 phantom time chip 18 of 21 figure 14. 3.3v power-down condition figure 15. output load
DS1315 phantom time chip 19 of 21 pin configurations (continued) package information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/dallaspackinfo .) 16-pin dip 20-pin tssop x1 x2 we n c bat1 gn d n c d q gnd 9 1 2 3 4 5 6 7 8 10 20 19 18 17 16 15 14 13 12 11 v cc1 v cc0 bat2 n c rst oe n c cei ceo r o m / ram 16-pin so ( 300 mil ) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 v cc1 v cc0 bat2 rst oe cei ceo rom/ram x1 x2 we bat1 gnd d q gnd pkg 16-pin dim. min max a in. mm 0.740 0.780 b in. mm 0.240 0.260 c in. mm 0.120 0.140 d in. mm 0.300 0.325 e in. mm 0.015 0.040 f in. mm 0.110 0.140 g in. mm 0.090 0.110 h in. mm 0.300 0.370 j in. mm 0.008 0.012 k in. mm 0.015 0.021
DS1315 phantom time chip 20 of 21 16-pin so pkg 16-pin dim min max a in. mm 0.402 10.21 0.412 10.46 b in. mm 0.290 7.37 0.300 7.65 c in. mm 0.089 2.26 0.095 2.41 e in. mm 0.004 0.102 0.012 0.30 f in. mm 0.094 2.38 0.105 2.68 g in. mm 0.050 bsc 1.27 bsc h in. mm 0.398 10.11 0.416 10.57 j in. mm 0.009 0.229 0.013 0.33 k in. mm 0.013 0.33 0.019 0.48 l in. mm 0.016 0.40 0.040 1.02 phi 0 8
DS1315 phantom time chip 21 of 21 16-pin tssop dim min max a mm ? 1.10 a1 mm 0.05 ? a2 mm 0.75 1.05 c mm 0.09 0.18 l mm 0.50 0.70 e1 mm 0.65 bsc b mm 0.18 0.30 d mm 6.40 6.90 e mm 4.40 nom g mm 0.25 ref h mm 6.25 6.55 phi 0 8

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